1. 2. 3. material content data sheet sales product name ipd22n08s2l-50 issued 29. august 2013 ma# MA000273813 package pg-to252-3-11 weight* 369.82 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.714 0.46 0.46 4634 4634 leadframe non noble metal iron 7439-89-6 0.234 0.06 634 inorganic material phosphorus 7723-14-0 0.070 0.02 190 non noble metal copper 7440-50-8 234.187 63.34 63.42 633253 634077 wire non noble metal aluminium 7429-90-5 0.928 0.25 0.25 2510 2510 encapsulation organic material carbon black 1333-86-4 1.271 0.34 3438 plastics epoxy resin - 22.249 6.02 60163 inorganic material silicondioxide 60676-86-0 103.617 28.02 34.38 280186 343787 leadfinish non noble metal tin 7440-31-5 3.740 1.01 1.01 10113 10113 plating non noble metal nickel 7440-02-0 0.091 0.02 245 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 246 solder noble metal silver 7440-22-4 0.043 0.01 116 non noble metal tin 7440-31-5 0.034 0.01 93 non noble metal lead 7439-92-1 1.636 0.44 0.46 4424 4633 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
